可靠性测试之：温度循环Power Temperature Cycle(PTC)
Power Temperature Cycle(PTC)Test condition: Ta = -20 °C … 40 °C
持续时间：
1000h，40天
The power and temperature cycling test is performed to determine the ability of a device to withstand alternate exposures at high and low temperature extremes and simultaneously the operating biases are periodically applied and removed. It is intended to simulate worst case conditions encountered in application environments. The power and temperature cycling test is considered destructive and is only intended for device qualification. This test method applies to semiconductor devices that are subjected to temperature excursions and required to power on and off during all temperatures.
进行功率和温度循环测试，以确定设备在高温和低温极端环境下承受交替暴露的能力，同时定期应用和消除操作偏差。它旨在模拟在应用程序环境中遇到的最坏情况。功率和温度循环测试被认为是破坏性的，仅用于设备鉴定。本测试方法适用于半导体器件，这些器件在所有温度条件下都要承受温度波动，并且需要开/关电源。
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